Failure Analysis

Find faults and verify designs

Integrated circuits are ever increasing in their complexity, which also holds true for their manufacture. When this finely tuned process does not work anymore, finding the issues can be a daunting task, given the small scaling (metal pitch for 7 nm node: Intel 36 nm, TSMC < 40 nm), and only Electron Microscope images to work with.

Scanning NV can track currents along their path that can be overlaid with the design to check for opens and shorts, at a size scale that can still resolve the Front End Of Line in the most modern manufacturing nodes. AC magentometry adds additional sensitivity and the possibility to distinguish specific signals by locking onto their frequency. Find faults or validate circuits from foundries for security relevant applications.

An example is shown below: Metal wires of ~300 nm width are visible in the 3 D AFM data, with an overlay of the measured magnetic field in color. The labyrinth of wires is not fully connected, but rather the current is localised to two wires, entering from the top left contact, exiting at the top right, reentering at the bottom right and exiting at the bottom left.

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